TY - GEN
T1 - Triaxial force measurement cantilever by sidewall-doping with rapid thermal diffusion
AU - Aoyama, Yuichiro
AU - Binh-Khiem, Nguyen
AU - Noda, Kentaro
AU - Takei, Yusuke
AU - Kan, Tetsuo
AU - Iwase, Eiji
AU - Matsumoto, Kiyoshi
AU - Shimoyama, Isao
PY - 2010/6/1
Y1 - 2010/6/1
N2 - We propose a triaxial force measurement cantilever with piezoresistors fabricated by rapid thermal diffusion sidewall-doping. The device is developed as a tool for applying quantitative mechanical stimuli to cells and measuring their mechanical properties at the same time. The device consists of a sensing tip, two sensing beams, and four wiring beams. We form piezoresistors on the surface of the sensing tip and the sidewalls of the two sensing beams. We confirmed that our device was able to measure triaxial forces. The displacement sensitivities of the device were 1.59×10-3 μm-1, 1.18×10-3 μm-1 and 3.26×10-4 μm-1 for x, y, and z-direction, respectively.
AB - We propose a triaxial force measurement cantilever with piezoresistors fabricated by rapid thermal diffusion sidewall-doping. The device is developed as a tool for applying quantitative mechanical stimuli to cells and measuring their mechanical properties at the same time. The device consists of a sensing tip, two sensing beams, and four wiring beams. We form piezoresistors on the surface of the sensing tip and the sidewalls of the two sensing beams. We confirmed that our device was able to measure triaxial forces. The displacement sensitivities of the device were 1.59×10-3 μm-1, 1.18×10-3 μm-1 and 3.26×10-4 μm-1 for x, y, and z-direction, respectively.
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U2 - 10.1109/MEMSYS.2010.5442332
DO - 10.1109/MEMSYS.2010.5442332
M3 - Conference contribution
AN - SCOPUS:77952772173
SN - 9781424457649
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 619
EP - 622
BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Y2 - 24 January 2010 through 28 January 2010
ER -