Underpotential deposition of copper incorporated into Nafion films cast on Au (111) surfaces

Gordana D. Adzic^*, Daniel Alberto Scherson

^*この研究の対応する著者

研究成果: Article › 査読

本文言語	English
ページ（範囲）	421-426
ページ数	6
ジャーナル	Journal of Electroanalytical Chemistry
巻	263
号	2
DOI	https://doi.org/10.1016/0022-0728(89)85109-5
出版ステータス	Published - 1989 5月 25
外部発表	はい

ASJC Scopus subject areas

@article{72c4aee99fc241ea9c3cbd5dd630df9a,

title = "Underpotential deposition of copper incorporated into Nafion films cast on Au (111) surfaces",

author = "Adzic, {Gordana D.} and Scherson, {Daniel Alberto}",

year = "1989",

month = may,

day = "25",

doi = "10.1016/0022-0728(89)85109-5",

language = "English",

volume = "263",

pages = "421--426",

journal = "Journal of Electroanalytical Chemistry",

issn = "0022-0728",

publisher = "Elsevier Sequoia",

number = "2",

}

TY - JOUR

T1 - Underpotential deposition of copper incorporated into Nafion films cast on Au (111) surfaces

AU - Adzic, Gordana D.

AU - Scherson, Daniel Alberto

PY - 1989/5/25

Y1 - 1989/5/25

UR - http://www.scopus.com/inward/record.url?scp=0011704152&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0011704152&partnerID=8YFLogxK

U2 - 10.1016/0022-0728(89)85109-5

DO - 10.1016/0022-0728(89)85109-5

M3 - Article

AN - SCOPUS:0011704152

SN - 0022-0728

VL - 263

SP - 421

EP - 426

JO - Journal of Electroanalytical Chemistry

JF - Journal of Electroanalytical Chemistry

IS - 2

ER -