TY - GEN
T1 - Void formation and reliability in gold-aluminum bonding
AU - Uno, T.
AU - Tatsumi, K.
AU - Ohno, Y.
PY - 1992/12/1
Y1 - 1992/12/1
N2 - Voids formed in gold-aluminum intermetallic compounds are known to degrade the long-term reliability of gold wire bonds to aluminum pads. We have investigated the diffusion behavior in the bonds annealed at elevated temperatures. The annealing environment has great influence on the voiding as well as the intermetallic formation. The ball bonds to aluminum pads after annealing in gaseous environments (Ar, N2, Ar+3%H2, Ar+500ppmO2 and air) exhibited sizable voids in the gold/compound interface causing the bond failure. However in the case of vacuum annealing the shear strength increases. The compound layer grows uniformly across the entire interface. There are no deleterious voids observed. It is confirmed that high reliability in the gold/aluminum interface can be obtained by vacuum annealing. Effects of the thickness of aluminum pads and bonding conditions on the voiding have been investigated.
AB - Voids formed in gold-aluminum intermetallic compounds are known to degrade the long-term reliability of gold wire bonds to aluminum pads. We have investigated the diffusion behavior in the bonds annealed at elevated temperatures. The annealing environment has great influence on the voiding as well as the intermetallic formation. The ball bonds to aluminum pads after annealing in gaseous environments (Ar, N2, Ar+3%H2, Ar+500ppmO2 and air) exhibited sizable voids in the gold/compound interface causing the bond failure. However in the case of vacuum annealing the shear strength increases. The compound layer grows uniformly across the entire interface. There are no deleterious voids observed. It is confirmed that high reliability in the gold/aluminum interface can be obtained by vacuum annealing. Effects of the thickness of aluminum pads and bonding conditions on the voiding have been investigated.
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M3 - Conference contribution
AN - SCOPUS:0027042905
SN - 0791807665
T3 - American Society of Mechanical Engineers, EEP
SP - 771
EP - 777
BT - American Society of Mechanical Engineers, EEP
PB - Publ by ASME
T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
Y2 - 9 April 1992 through 12 April 1992
ER -